Huawei Technologies on Thursday unveiled its latest Ascend 960 SuperPoD computing cluster and an upgraded version of its UnifiedBus interconnect technology, a key component of the Chinese tech giant’s strategy to build advanced artificial intelligence systems despite US semiconductor-related restrictions.
At the Huawei Connect 2026 conference in Shanghai, the Shenzhen-based firm introduced near-packaged optics – a placement structure enabling higher speeds and lower energy use – to the company’s SuperPoD architecture for the first time.
Huawei said the combination of its UnifiedBus interconnect technology and Hi-ONE optical system would allow a SuperPoD to connect as many as 4,000 processors, extending high-speed optical connections deeper into the computing system.
Huawei’s Ascend 950 SuperPoD was rolled out commercially last year.